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Electronic Chemicals: PCB Chemicals and Semiconductor Packaging Materials

Specialty Chemicals Update Program

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Published December 2022

PCBs are the backbone of electronic products. They are used to support and connect electronic components in all electronic applications. The PCB manufacturing process has basic steps such as etching, laminating, drilling, electroplating, lithographing, and screen printing. Many chemicals and materials are used in these steps. After all of these steps are completed, the PCB is tested, populated with components, and incorporated into the final electronic product.

Semiconductor packages serve to protect integrated circuits (ICs) during shipping and handling and to dissipate heat. The semiconductor packaging market is closely linked to the PCB manufacturing market because packages allow the die to be mounted on the PCB. Demand for packaging has been driven by the miniaturization of ICs, higher PCB board density and 3D packaging. In addition, demand for packaging materials is expected to grow as the Internet of Things (IoT) increases the need for sensors and other ICs.

Semiconductor packages serve to protect integrated circuits (ICs) during shipping and handling and to dissipate heat. The semiconductor packaging market is closely linked to the PCB manufacturing market because packages allow the die to be mounted on the PCB. Demand for packaging has been driven by the miniaturization of ICs, higher PCB board density and 3D packaging. In addition, demand for packaging materials is expected to grow as the Internet of Things (IoT) increases the need for sensors and other ICs.

The following pie charts show world consumption of PCB chemicals and semiconductor packaging materials.

 

The global market for chemicals used in the production of printed circuit boards (PCBs) and semiconductor packaging materials is expected to grow at an average annual rate of 3–4% through 2027. The ASEAN countries will have fastest growth rate, followed by South Korea, mainland China, Japan, and Taiwan, while North America and Western Europe will have lower growth rates.

Just a few of the global issues for the electronic chemicals industry are mentioned in the following paragraphs.

Regulations. Chemical and materials suppliers continue to face more restrictive environmental regulations globally. Existing regulations such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) impact almost all aspects of the electronics industry. RoHS calls for the removal of metals such as lead, cadmium, mercury, bismuth, and chromium VI as well as polybrominated biphenyls (PBB) and ozone-depleting substances from all PCB and semiconductor packaging materials. With the exception of exempt applications, implementation of RoHS is well under way and most large global suppliers have already developed “green” alternatives. REACH monitors all chemicals produced in or imported into Europe and requires registration of all imported and produced material in excess of one metric ton per year, and evaluation of the environmental impact of these substances. Another EU regulation, the Waste Electrical and Electronic Equipment Directive (WEEE) requires companies to provide a process for collecting and recycling end-of-life electronic products.

Asia. The importance of Asia in the electronics industry cannot be overemphasized. Manufacturing capability in mainland China, Taiwan, South Korea, and Japan make Asia the center of the electronics industry. Currently, almost all high-volume low-cost production of electronics is conducted in Asia.

Miniaturization. A greater number of transistors requires an increase in the number of I/O pin-outs on the board. The closer together the fine lines, the higher the requirement of the encapsulating material to insulate and protect them. Currently, most IC industry spending and production is focused on 13.5 nm nodes and smaller. The smallest node in mass production as of 2021 is 7nm.

Globalization. The impact of globalization started to affect chemical markets in the mid-1990s. Only 15 years later, it became standard practice to design and develop a product in one country, manufacture it in another and distribute it globally. Most successful semiconductor and electronics manufacturers established factories in Asia and the materials suppliers followed the lead of their customers. At first it was the availability of lowcost labor and a young workforce that drove companies to Asia, but in the past 15 years, Asian companies have developed cutting-edge, technologically advanced manufacturing capabilities and large-scale manufacturing facilities.

Age of communication and information. Globalization is not just about selling goods and services across the globe. It is also about changing demographics and immigration patterns. Companies are now selling and sourcing goods, services, and labor all over the globe. This requires rapid, uninterrupted access to information on customers, products, services, markets, competitors, end users, and more. The information needs to be timely and personalized. Populations are becoming more mobile and are moving to the centers of production. People want to communicate and collaborate with associates, friends, and families.

Board density and design complexity. Currently, the global growth of PCBs is being driven by the increased use of multilayered, flexible PCBs. The board density and design complexity keep increasing as electronic companies try to add more features to the product. Electronics designers are trying to design products with higher clock speeds. At higher speeds, speed and power dissipation become an issue requiring the use of advanced materials that can maintain their physical properties under ever-more-stressful conditions. At the same time, the electronics industry is extremely cost-sensitive. The properties of advanced materials and costs must be in balance.

Market demand. The chemical markets for PCB fabrication and semiconductor packaging are greatly influenced by the demand for products in the key markets. Some of the fastest-growing electronic markets are in communication and information using small wireless devices, including mobile phones and integrated devices like smartphones, and high-definition televisions. Computing products and computer peripherals are the other markets expected to show high growth. The global broadcasting market is turning digital. Companies are spending on HDTV, 4K and 8K broadcast and production. In industrial applications, there is an increasing amount of electronic content in automobiles. Another promising growth area is in medical devices. Miniaturization allows for the creation of smaller, more portable medical technology devices, such as in-home defibrillators.

For more detailed information, see the table of contents, shown below.

S&P Global’s Specialty Chemicals Update Program – Electronic Chemicals: PCB Chemicals and Semiconductor Raw Materials is the comprehensive and trusted guide for anyone seeking information on this industry. This latest report details global and regional information, including

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S&P Global’s Specialty Chemicals Update Program – Electronic Chemicals: PCB Chemicals and Semiconductor Raw Materials has been compiled using primary interviews with key suppliers and organizations, and leading representatives from the industry in combination with IHS Markit’s unparalleled access to upstream and downstream market intelligence and expert insights into industry dynamics, trade, and economics.

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  • Identify the competitive environment and key players
  • Assess key issues facing both suppliers and their end-use customers
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  • Keep abreast of industry structure changes, regulatory requirements, and other factors affecting profitability
  • Identify new business opportunities and threats
  • Follow important commercial developments
  • Recognize trends and driving forces influencing specialty chemical markets
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Table of Contents

Section Page Number

Executive summary12
Summary13
North America 19
Western Europe 20
Mainland China 20
Japan 20
South Korea 20
Taiwan 21
Other Asia 21
Introduction22
Abbreviations24
Overview of the PCB industry and the semiconductor packaging industry26
PCB industry 26
PCB markets 27
Semiconductor packaging industry 28
Semiconductor packaging markets 29
United States 30
Industry structure 30
Printed circuit board 30
Semiconductor packaging 31
Industry market trends 31
Western Europe 32
Industry structure 32
Industry market trends 33
Mainland China 35
Industry structure 35
Industry market trends 38
Japan 41
Industry structure 41
Industry market trends 41
South Korea 42
Industry structure 42
Industry market trends 42
Taiwan 43
Industry structure 43
Industry market trends 44
Other Asia 45
Industry structure 45
Industry market trends 46
Overview of the PCB and semiconductor packaging chemicals industry47
Structure of the industry 47
United States 47
Western Europe 49
Mainland China 50
Japan 51
South Korea 53
Taiwan 55
Company profiles 56
DuPont 56
MacDermid Alpha Electronics Solutions 57
Rogers Corporation 58
Showa Denko Materials Co., Ltd. 59
Sumitomo Bakelite Co., Ltd. 60
Operating characteristics 60
Research and development 60
Manufacturing 62
Marketing and technical service 62
Cost structure and profitability 63
Government regulations 64
United States 64
Western Europe 65
RoHS/WEEE directives 65
REACH 66
European Chips Act 67
Mainland China 67
Japan 69
Other Asia 69
Trends and opportunities 70
Technology 70
Business 71
Critical factors for success 72
Product types and markets74
Products and functions 74
PCB chemicals and materials 74
PCB substrates and materials 76
PCB resists 76
PCB etchants 77
PCB plating chemicals 77
Thick film pastes and solder pastes 78
Semiconductor packaging materials 81
Substrates 81
Encapsulants 81
Die-attach materials 82
Other 83
Technology and manufacturing 83
PCB chemicals and materials 83
PCB substrates and materials 83
PCB resists 84
PCB etchants 85
PCB plating chemicals 86
Thick film-pastes 87
Semiconductor packaging materials 87
Substrates or interposers 87
Encapsulants 88
Die-attach materials 88
Markets by region90
United States 90
Summary 90
PCB chemicals and materials 91
PCB substrates and materials 91
Consumption and markets 91
Market participants 93
Prices 96
Future trends and strategic issues 96
PCB resists 97
Consumption and markets 97
Market participants 97
Prices 98
Future trends and strategic issues 98
PCB etchants 98
Consumption and markets 98
Market participants 99
Prices 99
Future trends and strategic issues 99
PCB plating chemicals 100
Consumption and markets 100
Market participants 101
Prices 102
Future trends and strategic issues 102
Thick film pastes 102
Consumption and markets 102
Market participants 103
Prices 104
Future trends and strategic issues 104
Semiconductor packaging materials 105
Substrates 106
Consumption and markets 106
Market participants 106
Future trends and strategic issues 107
Encapsulants 107
Consumption and markets 107
Market participants 107
Prices 108
Future trends and strategic issues 108
Die-attach materials 109
Consumption and markets 109
Market participants 109
Prices 110
Future trends and strategic issues 110
Other 110
Western Europe 110
Summary 110
PCB chemicals and materials 111
PCB substrates and materials 111
Consumption and markets 111
Market participants 112
Prices 113
Future trends and strategic issues 113
PCB resists 115
Consumption and markets 115
Market participants 115
Prices 116
Future trends and strategic issues 117
PCB etchants 117
Consumption and markets 117
Market participants 117
Prices 118
Future trends and strategic issues 118
PCB plating chemicals 118
Consumption and markets 118
Market participants 119
Future trends and strategic issues 119
Thick film pastes 120
Consumption and markets 120
Market participants 121
Prices 121
Future trends and strategic issues 121
Semiconductor packaging materials 122
Substrates 123
Consumption and markets 123
Prices 123
Encapsulants 124
Consumption and markets 124
Market participants 124
Prices 124
Future trends and strategic issues 125
Die-attach materials 125
Consumption and markets 125
Market participants 126
Prices 126
Future trends and strategic issues 126
Mainland China 126
Summary 126
PCB chemicals and materials 127
PCB substrates and materials 127
Consumption and markets 127
Market participants 130
Prices 131
Future trends and strategic issues 132
PCB resists 132
Consumption and markets 132
Market participants 133
Prices 134
PCB etchants 134
Consumption and markets 134
Market participants 134
Prices 135
Future trends and strategic issues 135
PCB plating chemicals 135
Consumption and markets 135
Market participants 136
Future trends and strategic issues 136
Thick film pastes 137
Market and consumption 137
Market participants 137
Prices 138
Semiconductor packaging materials 138
Substrates 139
Consumption and markets 139
Market participants 139
Encapsulants 141
Consumption and markets 141
Market participants 142
Prices 144
Future trends and strategic issues 144
Die-attach materials 145
Other 146
Japan 146
Summary 146
PCB chemicals and materials 147
PCB substrates and materials 147
Consumption and markets 147
Market participants 150
Prices 152
Future trends and strategic issues 153
PCB resists 153
Consumption and markets 153
Market participants 154
Prices 154
Future trends and strategic issues 155
PCB etchants 155
Consumption and markets 155
Market participants 155
Prices 156
Future trends and strategic issues 156
PCB plating chemicals 157
Consumption and markets 157
Market participants 157
Prices 158
Future trends and strategies 158
Thick film pastes 158
Consumption and markets 158
Market participants 159
Prices 159
Future trends and strategic issues 159
Semiconductor packaging materials 159
Substrates 159
Consumption and markets 159
Market participants 160
Prices 160
Future trends and strategic issues 161
Encapsulants 161
Consumption and markets 161
Market participants 162
Prices 162
Future trends and strategic issues 162
Die-attach materials 163
Consumption and markets 163
Market participants 163
Prices 163
Future trends and strategic issues 164
Other 164
South Korea 164
Summary 164
PCB chemicals and materials 165
PCB substrates and materials 165
Consumption and markets 165
Market participants 166
Future trends and strategic issues 167
PCB resists 167
Consumption and markets 167
Market participants 167
Prices 168
Future trends and strategic issues 168
PCB etchants 168
Consumption and markets 168
Market participants 169
Prices 169
Future trends and strategic issues 169
PCB plating chemicals 170
Consumption and markets 170
Market participants 170
Prices 171
Future trends and strategic issues 171
Thick film pastes 171
Consumption and markets 171
Market participants 172
Prices 172
Future trends and strategic issues 172
Semiconductor packaging materials 172
Substrates 172
Consumption and markets 172
Market participants 173
Prices 173
Future trends and strategic issues 173
Encapsulants 173
Consumption and markets 173
Market participants 174
Prices 174
Future trends and strategic issues 174
Die-attach materials 175
Consumption and markets 175
Market participants 175
Prices 175
Future trends and strategic issues 176
Other 176
Taiwan 176
Summary 176
PCB chemicals and materials 177
PCB substrates and materials 177
Consumption and markets 177
Market participants 178
Future trends and strategic issues 179
PCB resists 179
Consumption and markets 179
Market participants 180
Prices 181
Future trends and strategic issues 181
PCB etchants 181
Consumption and markets 181
Market participants 181
Prices 182
Future trends and strategic issues 182
PCB plating chemicals 182
Consumption and markets 182
Market participants 183
Prices 183
Future trends and strategic issues 184
Thick film pastes 184
Consumption and markets 184
Market participants 184
Prices 184
Future trends and strategic issues 185
Semiconductor packaging materials 185
Substrates 185
Consumption and markets 185
Market participants 186
Future trends and strategic issues 186
Encapsulants 186
Consumption and markets 186
Market participants 186
Prices 186
Future trends and strategic issues 187
Die-attach materials 187
Consumption and markets 187
Market participants 188
Prices 188
Future trends and strategic issues 188
Other 188
Other Asia 188
Summary 188
PCB chemicals and materials 189
Consumption and markets 189
PCB substrates 189
PCB resist chemicals 190
PCB etchants 191
Plating chemicals 192
Thick film pastes 192
Consumption by country 193
Market participants 195
Prices 196
Future trends and strategic issues 196
Semiconductor packaging materials 196
Consumption and markets 196
Market participants 199
Prices 200
Future trends and strategic issues 200
Revisions201
Data Workbook202

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